Rs 3,700 crore India Chip facility at YEIDA to process 20,000 wafers monthly, create 3,500 jobs and boost ‘Made in India’ chip ecosystem
New Delhi: Prime Minister Narendra Modi on Saturday inaugurated the HCL–Foxconn joint venture semiconductor facility, India Chip Pvt. Ltd., in Uttar Pradesh via video conferencing. The initiative marks as a major milestone in India’s push for technological self-reliance and domestic chip manufacturing.
The groundbreaking ceremony for the project was held at the Yamuna Expressway Industrial Development Authority (YEIDA) region, where the Prime Minister also addressed industry leaders and officials, highlighting the government’s commitment to building a strong semiconductor ecosystem in the country.
Among the dignitaries present at the ceremony, Uttar Pradesh Chief Minister Yogi Adityanath, Union Minister for Railways, Information and Broadcasting, and Electronics and IT Ashwini Vaishnaw, along with several senior officials from the Central and state governments, industry representatives, and other guests.
The plant is being set up as a joint venture between HCL Group, holding a 60 percent stake, and Foxconn, with a 40 percent share. The project involves an investment of over Rs 3,700 crore.
Designed as an Outsourced Semiconductor Assembly and Test (OSAT) facility under the government’s Semiconductor Assembly, Testing, Marking and Packaging scheme, the unit will process up to 20,000 wafers per month by 2028. The chips produced will cater to mobile phones, laptops, tablets, automotive systems, consumer electronics and other devices.
Officials said the facility will create over 3,500 direct and indirect employment opportunities while promoting skill development, technology transfer and growth of ancillary industries. With six semiconductor projects now approved nationwide, Uttar Pradesh is expected to emerge as a key hub for electronics and chip production.
Describing the launch as a milestone for “Made in India” chips, the Prime Minister said the initiative reinforces India’s ambition to become a trusted global destination for high-end electronics and semiconductor manufacturing.
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